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型号	品牌	库存	描述	操作
TIC4000-00-00-0.5CC	Bergquist	5000	TIC 4000 0.5CC SYRINGE	+ - 咨询
TG-NSP35-30CC	t-Global Technology	5000	NON-SILICONE PUTTY 30CC GREY	+ - 咨询
4949G	Aavid, Thermal Division of Boyd Corporation	5000	THERMALBOND EPOXY 0.875OZ PACKET	+ - 咨询
TG-NSP80-1OZ	t-Global Technology	5000	NON-SILICONE PUTTY 1OZ GREY	+ - 咨询
TG4040-D-1000	t-Global Technology	5000	THERMAL SILICONE PUTTY 1KG	+ - 咨询
TIC4000-00-00-5CC	Bergquist	5000	TIC 4000 5CC SYRINGE	+ - 咨询
BT-403-H	Wakefield-Vette	5000	ALUMINUM FILLED BONDATHERM EPOXY	+ - 咨询
NTE424	NTE Electronics, Inc	5000	1 OZ HEAT SINK COMPOUND	+ - 咨询
P0200-20	Littelfuse Inc.	5000	COMPOUND HEAT SINK 2OZ JAR	+ - 咨询
2746204	Bergquist	5000	TGF3000SF-00-1500-50CC	+ - 咨询
TG-NSP35LV-4OZ	t-Global Technology	5000	NON-SILICONE THERMAL PUTTY 4OZ L	+ - 咨询
A16872-09	Laird Technologies - Thermal Materials	5000	TPUTTY 403 SYRINGE 30CC	+ - 咨询
2746207	Bergquist	5000	TGF3000SF-00-1500-200CC	+ - 咨询
2850FT BLACK 18 LB.	Ellsworth Adhesives	5000	EPOXY ENCAPSULANT 18 LB GALLON	+ - 咨询
2761872	Bergquist	5000	TGF3000SF-00-1500-400CC	+ - 咨询
65-00-GEL75-0300	Parker Chomerics	5000	THERM-A-GAP GEL 75 7.5 W/M-K DIS	+ - 咨询
8616-3ML	MG Chemicals	5000	SUPER THERMAL GREASE	+ - 咨询
100000F00000G	Aavid, Thermal Division of Boyd Corporation	5000	THERMAL PASTE	+ - 咨询
860-60G	MG Chemicals	5000	HEAT TRANS COMPOUND SILICONE	+ - 咨询
BT-302-50M	Wakefield-Vette	5000	FAST CURING ALUMINUM FILLED BOND	+ - 咨询