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South Korea Silicon Wafer Factory signs a new OEM agreement

2020/4/28 17:11:59

According to Korean media, on September 22, DB Hitech and A-pro Semicon, a Korean semiconductor company, announced that they had signed a commercial agreement on the development of GaN power semiconductor foundry technology, with the goal of developing 8-inch GaN power semiconductor technology.
According to the memorandum of understanding, both parties will promote "the development of GaN power semiconductor foundry technology" from 2022 to 2024. Specifically, Eastern High Tech will use 8-inch GaN epitaxial wafer products produced by A-pro Semicon to jointly develop core processes. The ultimate goal is to develop 8-inch GaN power semiconductor technology.
Through this cooperation agreement, A-pro Semicon will ensure a stable OEM partner. At the same time, the compatibility of 8-inch process equipment of Eastern High Tech will bring A-pro Semicon a stable OEM capacity, which is conducive to its further development of GaN power semiconductor business.
According to the data, A-pro Semicon is a semiconductor business subsidiary of A-PRO Co., Ltd. in South Korea. In 2020, A-pro Semicon introduced 8-inch MOCVD mass production equipment for GaN power semiconductors from Veeco, an American equipment factory. At the end of the same year, A-pro Semicon announced to jointly develop 8-inch 650V E-MODE GaN power transistors with IGSS GaN Pte Ltd (IGaN), a Singapore GaN on Si/SiC epitaxial company.
In June this year, it was reported that A-pro Semicon stabilized the yield of 650V high-voltage GaN power semiconductor components based on 8-inch epitaxial chips, and successfully realized mass production technology. At the same time, we have also developed low-voltage GaN power semiconductor components, enriching the product portfolio.
As one of the main forces of global wafer foundry, Eastern High Tech has also regarded GaN and SiC power semiconductors as the next generation growth engine, and has vigorously developed the third generation power semiconductor market in recent years.
In the field of SiC power semiconductor, Eastern High Tech disclosed in June this year that it plans to build an 8-inch SiC production line, with the goal of producing and supplying the first 1200V SiC MOSFET to finished cars in 2025. At present, the company is testing and producing 6-inch SiC power semiconductor.
In the field of GaN power semiconductor, Eastern High Tech announced the plan to grow 8-inch semiconductor components on silicon based GaN earlier this year. It is reported that the use of silicon based GaN technology can enhance the competitiveness of semiconductor manufacturing, thereby simplifying the wafer process and improving the profitability of the wafer foundry. Prior to this, TSMC has introduced the silicon based GaN technology into the 6-inch wafer foundry, and joined hands with Italian French Semiconductor to promote the development of GaN process technology, aiming to promote the landing application of separate and integrated GaN components.
From the current action, Eastern High Tech has accelerated the development of 8-inch GaN power semiconductor technology and products, which is expected to combine A-Pro Semicon's expertise and technical reserves in the 8-inch GaN epitaxial field, shorten the development cycle of core processes, and accelerate the process of 8-inch GaN power semiconductor product development and commercialization.
Source of cover picture: Paixin

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